Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857, NYSE: ATE) announced that a new mold thickness metrology system, the TS9000, for measuring the thickness of ...
Don't be so stuck in the circuits that you forget the importance of IC packages. Here are a couple cards from the Microchip 2005 product selector: While most design engineers are using surface mount ...
During electrical design process, certain design choices need to be made. One example is USB C type connector-based design with a straddle-mount connector. In such scenario, the overall PCB thickness ...
Dai Nippon Printing Co (DNP) has developed a new lead frame in response to efforts to slim down the semiconductor package mounted on electronic devices, including mobile terminals and PCs. Using this ...
Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...
TOKYO--(BUSINESS WIRE)-- Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a Glass Core Substrate (GCS) targeting next-generation semiconductor packages. The new product replaces ...
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