Increased density in advanced node chips and advanced packaging offers a way to greatly improve performance and reduce power, but it also makes it harder to inspect these devices for real and latent ...

X-ray and advanced automated techniques combine to create a capable tool for lead-free solder inspection needs. Within two years, solder used in electronics manufactured or sold in Europe must meet ...

Similar to the way in which radiography is used clinically for the identification of breaks or cracks in a patient’s bone(s), manufacturers utilize this method to identify cracks or flaws within their ...

ThreatScan-AS1 (ISC) is a robust, amorphous silicon, portable x-ray inspection system. It comprises, as standard, a detector panel with an imaging area of 430 mm x 347 mm, a new high-penetration 150 ...

AXI is an effective technology for finding manufacturing defects in electronics assembly operations. Manufacturers of advanced electronics products know that simultaneously producing a ...

In recent years, the area array components like BGA, QFN, CSP, and flip chips, are aplicate wider and wider in the electronics manufacturing. Such as BGA, comparing with other components, it has ...

X-ray and acoustic imaging are two very complimentary tools for non destructively inspecting the quality of electronics components. Both techniques give information on different aspects of component ...