Browse 40 market data Tables and 30 Figures spread through 80 Pages and in-depth TOC on "Ajinomoto Build-up Film Market - ...

To capitalize on the demand for generative AI, Toppan Holdings (formerly Toppan Printing) reportedly plans to invest approximately JPY60 billion (US$403 million) to expand the production capacity of ...

Gigavis is showing strong performance. It appears that the analysis predicting the establishment of a dominant position in glass substrates, such as flip-chip ball grid array (FC-BGA), is influencing ...

Jeong Cheol-dong, CEO and president of LG Innotek, vowed that his company will become a global leader in a next-generation semiconductor packaging substrate known as flip chip ball grid array (FC-BGA) ...

Samsung Electro-Mechanics is reportedly pouring over 1 trillion won ($662.3 million) into capital expenditure for a second consecutive year, concentrating its investment on FC-BGA substrates, a ...

[Asia Economy Reporter Kim Pyeonghwa] Samsung Electro-Mechanics announced on the 26th that it has developed an automotive semiconductor substrate (FC-BGA) applicable to advanced driver assistance ...

As smartphone launch prices rise due to a memory chip crunch—likely intensifying shipment declines and pressure on component suppliers to cut unit prices—LG Innotek is seeking a breakthrough by ...

Glass substrates are entering a critical pre-mass production phase as demand for high-performance AI chips accelerates. As AI workloads require larger chip sizes and higher bandwidth,... Saturday 11 ...