Deep reactive ion etching (DRIE) is a highly anisotropic plasma etching process that creates deep, near-vertical features in silicon and related microfabrication materials. DRIE extends ordinary ...

For maximum resolution in a scanning tunneling microscope (STM), an extremely sharp metallic tip is required, which serves as the point through which the STM “scans” a sample. A blunt tip reduces STM ...

After more than a decade of research and development, Tokyo Electron Miyagi Ltd. has introduced an innovative semiconductor etching method that achieves etch rates up to five times faster than ...

The semiconductor industry is one of the most advanced and complex in the world. The semiconductor industry relies on highly specialized supply chains and manufacturing equipment. This ecosystem ...

A team of physicists has uncovered some of the physics that make possible the etching of silicon computer chips, which power cell phones, computers, and a huge range of electronic devices. Physicist ...

An example of directional etching for nanohole arrays of less than 500nm in diameter. (Image: A*STAR Institute of Materials Research and Engineering) Wet etching can be classified into two main types ...

A new approach combining atomic layer deposition and organic film etch process may solve critical challenges in the various processes in advanced nodes. We demonstrated a high selective and ...